Wish Formula C450 Bubble Peeling Pad is a unique sponge providing exfoliation and vitamin treatment to reveal luminous, hydrated skin. The exfoliating pad uses natural AHA to remove skin impurities, dead skill cells and sebum. The puff is convenient and easy-to-use drenched in essence containing brightening Vitamin C & hydrating Hyaluronic acid. This pad is fun to use and all skin types can indulge in this product.
How to use:
Remove peeling pad from the packaging and massage to create plenty of bubbles. Gently massage pad onto clean, damp face with the fibre side for 3 - 5 minutes. Flip the pad over and gently pat softer side into the skin. Lastly, rinse off with lukewarm water.
Water, Cocamidopropyl Betaine, Glycerin, Dipropylene Glycol, Disodium Cocoamphodiacetate, Lactic Acid, Glycolic Acid, Sodium Lauroyl Sarcosinate, 3-o-Ethyl Ascorbic Acid, Lactobacillus/Olive Leaf Ferment Extract, Saccharomyces/Peppermint Leaf Ferment Filtrate, Lactobacillus/Clover Flower Ferment Extract, Sodium Hyaluronate, Polyglutamic Acid, Impatiens Balsamina Flower Extract, Rosa Multiflora Fruit Extract, Lepidium Meyenii Root Extract, Eriobotrya Japonica Leaf Extract, Pachyrrhizus Eosus Root Extract, Aurebasidium Pullulans Ferment, 1,2-Hexanediol, Butylene Glycol, Arginine, DMDM Hydantoin, Parfum
Size: 1 pad (22ml)