Wish Formula C200 Bubble Peeling Pad is a unique sponge providing facial peel and vitamin treatment to reveal luminous, hydrated skin. The exfoliating pad uses natural AHA to remove skin impurities, dead skill cells and sebum. The puff is convenient and easy-to-use drenched in essence containing brightening Vitamin C & hydrating Hyaluronic acid. This pad is fun to use and all skin types can indulge in this product.
How to use:
Remove peeling pad from the packaging and massage to create plenty of bubbles. Gently massage pad onto clean, damp face with the fibre side for 2 - 3 minutes while avoiding eye and mouth areas. Flip the pad over and gently pat softer side into the skin. Lastly, rinse off with lukewarm water.
Recommended to be used once per week. If the skin is sensitive once every 2 weeks. Apply SPF if pad is used during the day.
Water, Cocamidopropyl Betaine, Disodium Cocoamphodiacetate, Lactic Acid, Glycerin, Glycolic Acid, Sodium Lauroyl Sarcosinate, Dipropylene Glycol, 3-o-Ethyl Ascorbic Acid, Lactobacillus/Olive Leaf Ferment Extract, Saccharomyces/Peppermint Leaf Ferment Filtrate, Lactobacillus/Clover Flower Ferment Extract, Sodium Hyaluronate, Polyglutamic Acid, Apium Graveolens (Celery) Extract, Brassica Oleracea Capitata (Cabbage) Leaf Extract, Oryza Sativa (Rice) Extract, Solanum Lycopersicum (Tomato) Fruit/Leaf/Stem Extract, Brassica Rapa (Turnip) Leaf Extract, Daucus Carota Sativa (Carrot) Root Extract, Brassica Oleracea Italica (Broccoli) Extract, 1,2-Hexanediol, Butylene Glycol, Arginine, DMDM Hydantoin, Parfume
Size: 1 pad (15ml)